november 2012 ? 2011 fairchild semiconductor corporation www.fairchildsemi.com FSA3031 ? rev. 1.0.4 FSA3031 ? dual high-speed usb2.0 switch with mobile high-definition link (mhl?) switch FSA3031 ? dual high-speed usb2.0 with mobile high-definition link (mhl?) features ? low on capacitance: 4.6 pf/6.75 pf mhl/usb (typical) ? low power consumption: 30 a maximum ? supports mhl rev. 2.0 ? passes 1080 p/60 fps (3 gbps) mhl data eye diagram mask compliance ? mhl data rate: 4.7gbps with ideal input source ? packaged in 12-lead umlp (1.8 x 1.8 mm) ? over-voltage tolerance (ovt) on all usb ports up to 5.25 v without external components applications ? cell phones and digital cameras important note: for additional performance information, please contact interface@fairchildsemi.com . description the FSA3031 is a bi-directional, low-power, high-speed, 3:1, dual usb2.0 and mhl switch. configured as a double-pole, triple-throw (dp3t) switch; it is optimized for switching between dual high- or full-speed usb and mobile high-definition link sources (mhl? rev. 2.0 specification). the FSA3031 contains special circuitry on the switch i/o pins, for applications where the v cc supply is powered off (v cc =0), that allows the device to withstand an over-voltage condition. this switch is designed to minimize current consumption even when the control voltage applied to the cont rol pins is lower than the supply voltage (v cc ). this feature is especially valuable to mobile applications, such as cell phones; allowing direct interface with the general-purpose i/os of the baseband processor. other applications include switching and connector sharing in portable cell phones, digital cameras, and notebook computers. ordering information part number top mark operating temperature range package FSA3031umx lx -40 to +85c 12-lead, ultrathin molded leadless package (umlp), 1.8 mm x 1.8 mm figure 1. typical application all trademarks are the property of their respective owners.
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FSA3031 ? rev. 1.0.4 12 FSA3031 ? dual high-speed usb2.0 switch with mobile high-definition link (mhl?) switch physical dimensions figure 20. 12-lead, ultrathin molded leadless package (umlp) package drawings are provided as a service to customers consi dering fairchild components. drawings may change in any manner without notice. please note the revision and/or date on the drawi ng and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packa ging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ . a b c seating plane recommended land pattern notes: a. package does not fully conform to jedec standard. b. dimensions are in millimeters. c. dimensions and tolerances per asme y14.5m, 1994. d. land pattern recommendation is based on fsc design only. e. drawing filename: mkt-umlp12arev4. scale : 2x lead option 1 scale : 2x lead option 2 detail a scale : 2x pin#1 ident top view bottom view 0.10 c 0.08 c 0.10 c 2x 2x side view 0.10 c 0.05 0.00 3 6 1 0.10 cab 0.05 c 0.55 max. 12 1.80 1.80 0.40 0.25 0.15 (12x) 0.35 0.45 2.10 2.10 0.40 0.563 (11x) 0.20 (12x) 1 0.152 9 0.588 detail a pin#1 ident (11x) package edge 0.10 0.10 0.45 0.35 0.10
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FSA3031 ? rev. 1.0.4 13 FSA3031 ? dual high-speed usb2.0 switch with mobile high-definition link (mhl?) switch
|
