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T24C64V TDA4050 DEVICE 13007 CY7C656 S2D13R SPV1520 E470M
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    意法半导
STMICROELECTRONICS[STMicroelectronics]
Part No. 54VCXH162244
OCR Text ...IFIED PRODUCT SMD 5962-05210 flat-48 All inputs and outputs are equipped with protection circuits against static discharge, giving them 2KV ESD immunity and transient excess voltage. Figure 1: Pin Connection DESCRIPTION The 54VCXH1...
Description LOW VOLTAGE CMOS 16-BIT BUS BUFFER (3-STATE INV) WITH 3.6V TOLERANT INPUTS AND OUTPUTS

File Size 391.72K  /  11 Page

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    NTMFS4120N

ON Semiconductor
Part No. NTMFS4120N
OCR Text ...v, 31 a, single n?channel, so?8 flat lead features ? low r ds(on) ? optimized gate charge ? low inductance so?8 package ? these are pb?free devices* applications ? notebooks, graphics cards ? dc?dc converters ? synchronous rectification max...
Description Power MOSFET 30V, 31A, Single N Channel, SO8 flat Lead(30V, 31A锛????OSFET)

File Size 71.94K  /  6 Page

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    LPC1853JET256 LPC1857FET256 LPC1837JET256 LPC1833FET256 LPC1833JBD144 LPC1833JET100 LPC1833JET256 LPC1837FET256 LPC1837J

NXP Semiconductors
Part No. LPC1853JET256 LPC1857FET256 LPC1837JET256 LPC1833FET256 LPC1833JBD144 LPC1833JET100 LPC1833JET256 LPC1837FET256 LPC1837JBD144 LPC1837JET100 LPC1825JBD144 LPC1822JET100 LPC1823JET100 LPC1823JBD144 LPC1853JBD208 LPC1857JET256 LPC1817JET100 LPC1827JET100 LPC1857JBD208
OCR Text ...qfp208 plastic low profile quad flat package; 208 leads; body 28 ? 28 ? 1.4 mm sot459-1 lpc1853fet256 lbga256 plastic low profile ball grid array package; 256 balls; body 17 ? 17 ? 1 mm sot740-2 lpc1853jet256 lbga256 plastic low pro...
Description 512kB flash, 136kB SRAM, Ethernet, LCD, LBGA256 package
1024kB flash, 136kB SRAM, Ethernet, LCD, LBGA256 package
1024kB flash, 136kB SRAM, Ethernet, LBGA256 package
512kB flash, 136kB SRAM, Ethernet, LBGA256 package
512kB flash, 136kB SRAM, Ethernet, LQFP144 package
512kB flash, 136kB SRAM, Ethernet, TFBGA100 package
1024kB flash, 136kB SRAM, Ethernet, LQFP144 package
1024kB flash, 136kB SRAM, Ethernet, TFBGA100 package
768kB flash, 136kB SRAM, LQFP144 package
512kB flash, 104kB SRAM, TFBGA100 package
512kB flash, 104kB SRAM, LQFP144 package
512kB flash, 136kB SRAM, Ethernet, LCD, LQFP208 package
1024kB flash, 136kB SRAM, TFBGA100 package
1024kB flash, 136kB SRAM, Ethernet, LCD, LQFP208 package

File Size 2,714.94K  /  148 Page

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    UPA835 UPA835TC UPA835TC-T1

NEC Corp.
NEC[NEC]
Part No. UPA835 UPA835TC UPA835TC-T1
OCR Text flat-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE DESCRIPTION The PA835TC has built-in two different transistors (Q1 and Q2) for low noise amplification in the VHF band to UHF band. FEATURES * Low noise Q1 : NF = 1.5 dB TYP. @ ...
Description NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A flat-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE

File Size 69.71K  /  12 Page

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    Micropac Industries, Inc.
MICROPAC[Micropac Industries]
17
19
21
15
Part No. 61060-102 61060 61060-001 61060-002 61060-101
OCR Text ... is available with a wide angle flat lens or narrow angle domed lens for minimum response to stray light. High sensitivity, low dark current leakage, and low saturation voltage make this device ideal for interfacing with TTL circuits. Also ...
Description CONNECTOR ACCESSORY
PHOTODIODE “PIGTAIL”
PHOTODIODE PIGTAIL Micropac Industries

File Size 75.04K  /  2 Page

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    MAXWELL[Maxwell Technologies]
Part No. 6484RPFK 6484 6484RPFE 6484RPFH 6484RPFI
OCR Text ... Package: * - 14 pin Rad-Pak(R) flat package * Rail-to-Rail input common-mode voltage range (guaranteed over temperature * Rail-to-Rail output swing (within 20 mV of supply rail, 100 k load) * Guaranteed 3V, 5V and 15V performance * Excelle...
Description CMOS Quad Rail-to-Rail I/O Op Amp

File Size 79.04K  /  7 Page

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    IRF[International Rectifier]
Part No. 70MT160PB 100MT160PA 100MT160PB 40MT160PA 40MT160PB 70MT160PA 100MT140PA 100MT140PB MTP3-PHASE 40MT140PA 40MT140PB 70MT140PA 70MT140PB
OCR Text ...age Direct Mounting to heatsink flat-Pin/ Round-Pin versions with PCB solderable terminals Low junction-to-case Thermal Resistance 3500 VRMS insulation voltage UL approval pending Power Module 45 A 75 A 100 A Applications: Power co...
Description 1600V 3 Phase Bridge in a MTP package with flat pins
1600V 3 Phase Bridge in a MTP package with round pins.
THREE PHASE BRIDGE

File Size 120.70K  /  8 Page

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    TLSG5101

Vishay Siliconix
Part No. TLSG5101
OCR Text flat tinted top-diffused package color type technology angle of half intensity red tlsh510. gaasp on gap 50 yellow tlsy510. gaasp on gap 50 green tlsg510. gap on gap 50 description this series was developed for use as compact su...
Description Symbol LED, 2.5 x 5 mm flat Tinted Top-Diffused Package

File Size 120.32K  /  7 Page

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    ST1843

STMicroelectronics
Part No. ST1843
OCR Text ...nd other harsh environments. flat-8 table 1. device summary order codes duty cycle max radiation level qua lity level eppl package lead finish mass (g) st1843k1 100% 50 krad (si) engineering model - flat-8 gold 0.45 st1843fkg 100% 50 kra...
Description Rad-tolerant current mode PWM controller

File Size 489.62K  /  25 Page

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    PM75B4LA060

Mitsubishi Electric Sem...
Mitsubishi Electric Semiconductor
Part No. PM75B4LA060
OCR Text flat-BASE TYPE INSULATED PACKAGE PM75B4LA060 FEATURE a) Adopting new 5th generation IGBT (CSTBT TM ) chip, which performance is improved by 1m fine rule process. For example, typical Vce(sat)=1.55V @Tj=125C b) Over-temperature protecti...
Description flat-BASE TYPE INSULATED PACKAGE

File Size 142.14K  /  8 Page

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